CeramCool® heat sinks are an effective combination of PCB and heat sink for the safe cooling of thermally sensitive components and circuits. They enable direct and permanent connection of components and are ideal for thermal management and cooling of power-intensive circuits in high performance electronics, high power LEDs or photovoltaic systems.
Chip-on-heatsink technology eliminates the need for additional layers and thermal barriers required in traditional designs. In addition to reducing thermal resistance, this also reduces the number of components and potential sources of failure in the overall system. This has a positive impact on assembly time and ultimately system cost. When it comes to innovative thermal management with ceramic heatsinks, the following applies "Keep it simple" - a simplified system design optimises heat dissipation.
The ceramic materials used are Rubalit® aluminum oxide and Alunit® aluminum nitride, which can be provided with various metallisations and conductive path structures, if required also three-dimensionally and "around the edge". With chip-on-heatsink, CeramTec has also developed a process that enables optimal thermal coupling to the cooling medium.
With high quality products and considerate service, we will work together with you to enhance your business and improve the efficiency. Please don't hesitate to contact us to get more details of heat sink extrusion profiles, Aluminium Heat Sink, CUSTOM ALUMINIUM PROFILES.